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备忘 | 值得收藏的360个PCB专业术语中英互译

捷多邦科技 2018-12-26 11:21 发文

一、综合词汇

1、印制电路:printed circuit

2、印制线路:printed wiring

3、印制板:printed board

4、印制板电路:printed circuit board(PCB)

5、印制线路板:printed wiring board(PWB)

6、印制组件:printed component

7、印制接点:printed contact

8、印制板装配:printed board assembly

9、板:board

10、单面印制板:single-sided printed board(SSB)

11、双面印制板:double-sided printed board(DSB)

12、多层印制板:mulitlayer printed board(MLB)

13、多层印制电路板:mulitlayer printed circuit board

14、多层印制线路板:mulitlayer prited wiring board

15、刚性印制板:rigid printed board

16、刚性单面印制板:rigid single-sided printed borad

17、刚性双面印制板:rigid double-sided printed borad

18、刚性多层印制板:rigid multilayer printed board

19、挠性多层印制板:flexible multilayer printed board

20、挠性印制板:flexible printed board

21、挠性单面印制板:flexible single-sided printed board

22、挠性双面印制板:flexible double-sided printed board

23、挠性印制电路:flexible printed circuit(FPC)

24、挠性印制线路:flexible printed wiring

25、刚性印制板:flex-rigid printed board,rigid-flex printed board

26、刚性双面印制板:flex-rigid double-sided printed board,rigid-flex double-sided printed

27、刚性多层印制板:flex-rigid multilayer printed board,rigid-flex multilayer printed board

28、齐平印制板:flush printed board

29、金属芯印制板:metal core printed board

30、金属基印制板:metal base printed board

31、多重布线印制板:mulit-wiring printed board

32、陶瓷印制板:ceramic substrate printed board

33、导电胶印制板:electroconductive paste printed board

34、模塑电路板:molded circuit board

35、模压印制板:stamped printed wiring board

36、顺序层压多层印制板:sequentially-laminated mulitlayer

37、散线印制板:discrete wiring board

38、微线印制板:micro wire board

39、积层印制板:buile-up printed board

40、积层多层印制板:build-up mulitlayer printed board(BUM)

41、积层挠印制板:build-up flexible printed board

42、表面层合电路板:surface laminar circuit(SLC)

43、埋入凸块连印制板:B2it printed board

44、多层膜基板:multi-layered film substrate(MFS)

45、层间全内导通多层印制板:ALIVH multilayer printed board

46、载芯片板:chip on board(COB)

47、埋电阻板:buried resistance board

48、母板:mother board

49、子板:daughter board

50、背板:backplane

51、裸板:bare board

52、键盘板夹心板:copper-invar-copper board

53、动态挠性板:dynamic flex board

54、静态挠性板:static flex board

55、可断拼板:break-away planel

56、电缆:cable

57、挠性扁平电缆:flexible flat cable(FFC)

58、薄膜开关:membrane switch

59、混合电路:hybrid circuit

60、厚膜:thick film

61、厚膜电路:thick film circuit

62、薄膜:thin film

63、薄膜混合电路:thin film hybrid circuit

64、互连:interconnection

65、导线:conductor trace line

66、齐平导线:flush conductor

67、传输线:transmission line

68、跨交:crossover

69、板边插头:edge-board contact

70、增强板:stiffener

71、基底:substrate

72、基板面:real estate

73、导线面:conductor side

74、组件面:component side

75、焊接面:solder side

76、印制:printing

77、网格:grid

78、图形:pattern

79、导电图形:conductive pattern

80、非导电图形:non-conductive pattern

81、字符:legend

82、标志:mark

二、基材:

1、基材:base material

2、层压板:laminate

3、覆金属箔基材:metal-clad bade material

4、覆铜箔层压板:copper-clad laminate(CCL)

5、单面覆铜箔层压板:single-sided copper-clad laminate

6、双面覆铜箔层压板:double-sided copper-clad laminate

7、复合层压板:composite laminate

8、薄层压板:thin laminate

9、金属芯覆铜箔层压板:metal core copper-clad laminate

10、金属基覆铜层压板:metal base copper-clad laminate

11、挠性覆铜箔绝缘薄膜:flexible copper-clad dielectric film

12、基体材料:basis material

13、预浸材料:prepreg

14、粘结片:bonding sheet

15、预浸粘结片:preimpregnated bonding sheer

16、环氧玻璃基板:epoxy glass substrate

17、加成法用层压板:laminate for additive process

18、预制内层覆箔板:mass lamination panel

19、内层芯板:core material

20、催化板材:catalyzed board,coated catalyzed laminate

21、涂胶催化层压板:adhesive-coated catalyzed laminate

22、涂胶无催层压板:adhesive-coated uncatalyzed laminate

23、粘结层:bonding layer

24、粘结膜:film adhesive

25、涂胶粘剂绝缘薄膜:adhesive coated dielectric film

26、无支撑胶粘剂膜:unsupported adhesive film

27、覆盖层:cover layer(cover lay)

28、增强板材:stiffener material

29、铜箔面:copper-clad surface

30、去铜箔面:foil removal surface

31、层压板面:unclad laminate surface

32、基膜面:base film surface

33、胶粘剂面:adhesive faec

34、原始光洁面:plate finish

35、粗面:matt finish

36、纵向:length wise direction

37、模向:cross wise direction

38、剪切板:cut to size panel

39、酚醛纸质覆铜箔板:phenolic cellulose paper copper-clad laminates(phenolic/paper CCL)

40、环氧纸质覆铜箔板:epoxide cellulose paper copper-clad laminates(epoxy/paper CCL)

41、环氧玻璃布基覆铜箔板:epoxide woven glass fabric copper-clad laminates

42、环氧玻璃布纸复合覆铜箔板:epoxide cellulose paper core,glass cloth surfaces copper-clad laminates

43、环氧玻璃布玻璃纤维复合覆铜箔板:epoxide non woven/woven glass reinforced copper-clad laminates

44、聚酯玻璃布覆铜箔板:ployester woven glass fabric copper-clad laminates

45、聚酰亚胺玻璃布覆铜箔板:polyimide woven glass fabric copper-clad laminates

46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板:bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates

47、环氧合成纤维布覆铜箔板:epoxide synthetic fiber fabric copper-clad laminates

48、聚四乙烯玻璃纤维覆铜箔板:teflon/fiber glass copper-clad laminates

49、超薄型层压板:ultra thin laminate

50、陶瓷基覆铜箔板:ceramics base copper-clad laminates

51、紫外线阻挡型覆铜箔板:UV blocking copper-clad laminates

三、基材的材料

1、A阶树脂:A-stage resin

2、B阶树脂:B-stage resin

3、C阶树脂:C-stage resin

4、环氧树脂:epoxy resin

5、酚醛树脂:phenolic resin

6、聚酯树脂:polyester resin

7、聚酰亚胺树脂:polyimide resin

8、双马来酰亚胺三嗪树脂:bismaleimide-triazine resin

9、丙烯酸树脂:acrylic resin

10、三聚氰胺甲醛树脂:melamine formaldehyde resin

11、多官能环氧树脂:polyfunctional epoxy resin

12、溴化环氧树脂:brominated epoxy resin

13、环氧酚醛:epoxy novolac

14、氟树脂:fluroresin

15、硅树脂:silicone resin

16、硅烷:silane

17、聚合物:polymer

18、无定形聚合物:amorphous polymer

19、结晶现象:crystalline polamer

20、双晶现象:dimorphism

21、共聚物:copolymer

22、合成树脂:synthetic

23、热固性树脂:thermosetting resin

24、热塑性树脂:thermoplastic resin

25、感旋光性树脂:photosensitive resin

26、环氧当量:weight per epoxy equivalent(WPE)

27、环氧值:epoxy value

28、双氰胺:dicyandiamide

29、粘结剂:binder

30、胶粘剂:adesive

31、固化剂:curing agent

32、阻燃剂:flame retardant

33、遮光剂:opaquer

34、增塑剂:plasticizers

35、不饱和聚酯:unsatuiated polyester

36、聚酯薄膜:polyester

37、聚酰亚胺薄膜:polyimide film(PI)

38、聚四氟乙烯:polytetrafluoetylene(PTFE)

39、聚全氟乙烯丙烯薄膜:perfluorinated ethylene-propylene copolymer film(FEP)

40、增强材料:reinforcing material

41、玻璃纤维:glass fiber

42、E玻璃纤维:E-glass fibre

43、D玻璃纤维:D-glass fibre

44、S玻璃纤维:S-glass fibre

45、玻璃布:glass fabric

46、非织布:non-woven fabric

47、玻璃纤维垫:glass mats

48、纱线:yarn

49、单丝:filament

50、绞股:strand

51、纬纱:weft yarn

52、经纱:warp yarn

53、但尼尔:denier

54、经向:warp-wise

55、纬向:weft-wise,filling-wise

56、织物经纬密度:thread count

57、织物组织:weave structure

58、平纹组织:plain structure

59、坏布:grey fabric

60、稀松织物:woven scrim

61、弓纬:bow of weave

62、断经:end missing

63、缺纬:mis-picks

64、纬斜:bias

65、折痕:crease

66、云织:waviness

67、鱼眼:fish eye

68、毛圈长:feather length

69、厚薄段:mark

70、裂缝:split

71、捻度:twist of yarn

72、浸润剂含量:size content

73、浸润剂残留量:size residue

74、处理剂含量:finish level

75、浸润剂:size

76、偶联剂:couplint agent

77、处理织物:finished fabric

78、聚酰胺纤维:polyarmide fiber

79、聚酯纤维非织布:non-woven polyester fabric

80、浸渍绝缘纵纸:impregnating insulation paper

81、聚芳酰胺纤维纸:aromatic polyamide paper

82、断裂长:breaking length

83、吸水高度:height of capillary rise

84、湿强度保留率:wet strength retention

85、白度:whitenness

86、陶瓷:ceramics

87、导电箔:conductive foil

88、铜箔:copper foil

89、电解铜箔:electrodeposited copper foil(ED copper foil)

90、压延铜箔:rolled copper foil

91、退火铜箔:annealed copper foil

92、压延退火铜箔:rolled annealed copper foil(RA copper foil)

93、薄铜箔:thin copper foil

94、涂胶铜箔:adhesive coated foil

95、涂胶脂铜箔:resin coated copper foil(RCC)

96、复合金属箔:composite metallic material

97、载体箔:carrier foil

98、殷瓦:invar

99、箔(剖面)轮廓:foil profile

100、光面:shiny side

101、粗糙面:matte side

102、处理面:treated side

103、防锈处理:stain proofing

104、双面处理铜箔:double treated foil

四、设计

1、原理图:shematic diagram

2、逻辑图:logic diagram

3、印制线路布设:printed wire layout

4、布设总图:master drawing

5、可制造性设计:design-for-manufacturability

6、计算机辅助设计:computer-aided design.(CAD)

7、计算机辅助制造:computer-aided manufacturing.(CAM)

8、计算机集成制造:computer integrat manufacturing.(CIM)

9、计算机辅助工程:computer-aided engineering.(CAE)

10、计算机辅助测试:computer-aided test.(CAT)

11、电子设计自动化:electric design automation.(EDA)

12、工程设计自动化:engineering design automaton.(EDA2)

13、组装设计自动化:assembly aided architectural design.(AAAD)

14、计算机辅助制图:computer aided drawing

15、计算机控制显示:computer controlled display.(CCD)

16、布局:placement

17、布线:routing

18、布图设计:layout

19、重布:rerouting

20、模拟:simulation

21、逻辑模拟:logic simulation

22、电路模拟:circit simulation

23、时序模拟:timing simulation

24、模块化:modularization

25、布线完成率:layout effeciency

26、机器描述格式:machine descriptionm format.(MDF)

27、机器描述格式数据库:MDF databse

28、设计数据库:design database

29、设计原点:design origin

30、优化(设计):optimization(design)

31、供设计优化坐标轴:predominant axis

32、表格原点:table origin

33、镜像:mirroring

34、驱动文件:drive file

35、中间文件:intermediate file

36、制造文件:manufacturing documentation

37、队列支撑数据库:queue support database

38、组件安置:component positioning

39、图形显示:graphics dispaly

40、比例因子:scaling factor

41、扫描填充:scan filling

42、矩形填充:rectangle filling

43、填充域:region filling

44、实体设计:physical design

45、逻辑设计:logic design

46、逻辑电路:logic circuit

47、层次设计:hierarchical design

48、自顶向下设计:top-down design

49、自底向上设计:bottom-up design

50、线网:net

51、数字化:digitzing

52、设计规则检查:design rule checking

53、走(布)线器:router(CAD)

54、网络表:net list

55、计算机辅助电路分析:computer-aided circuit analysis

56、子线网:subnet

57、目标函数:objective function

58、设计后处理:post design processing(PDP)

59、交互式制图设计:interactive drawing design

60、费用矩阵:cost metrix

61、工程图:engineering drawing

62、方块框图:block diagram

63、迷宫:moze

64、组件密度:component density

65、巡回售货员问题:traveling salesman problem

66、自由度:degrees freedom

67、入度:out going degree

68、出度:incoming degree

69、曼哈顿距离:manhatton distance

70、欧几里德距离:euclidean distance

71、网络:network

72、阵列:array

73、段:segment

74、逻辑:logic

75、逻辑设计自动化:logic design automation

76、分线:separated time

77、分层:separated layer

78、定顺序:definite sequenc

五、形状与尺寸:

1、导线(信道):conduction(track)

2、导线(体)宽度:conductor width

3、导线距离:conductor spacing

4、导线层:conductor layer

5、导线宽度/间距:conductor line/space

6、第一导线层:conductor layer No.1

7、圆形盘:round pad

8、方形盘:square pad

9、菱形盘:diamond pad

10、长方形焊盘:oblong pad

11、子弹形盘:bullet pad

12、泪滴盘:teardrop pad

13、雪人盘:snowman pad

14、V形盘:V-shaped pad

15、环形盘:annular pad

16、非圆形盘:non-circular pad

17、隔离盘:isolation pad

18、非功能连接盘:monfunctional pad

19、偏置连接盘:offset land

20、腹(背)裸盘:back-bard land

21、盘址:anchoring spaur

22、连接盘图形:land pattern

23、连接盘网格阵列:land grid array

24、孔环:annular ring

25、组件孔:component hole

26、安装孔:mounting hole

27、支撑孔:supported hole

28、非支撑孔:unsupported hole

29、导通孔:via

30、镀通孔:plated through hole(PTH)

31、余隙孔:access hole

32、盲孔:blind via(hole)

33、埋孔:buried via hole

34、埋/盲孔:buried/blind via

35、任意层内部导通孔:any layer inner via hole(ALIVH)

36、全部钻孔:all drilled hole

37、定位孔:toaling hole

38、无连接盘孔:landless hole

39、中间孔:interstitial hole

40、无连接盘导通孔:landless via hole

41、引导孔:pilot hole

42、端接全隙孔:terminal clearomee hole

43、准表面间镀覆孔:quasi-interfacing plated-through hole

44、准尺寸孔:dimensioned hole

45、在连接盘中导通孔:via-in-pad

46、孔位:hole location

47、孔密度:hole density

48、孔图:hole pattern

49、钻孔图:drill drawing

50、装配图:assembly drawing

51、印制板组装图:printed board assembly drawing

52、参考基准:datum referan

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声明:本文为OFweek维科号作者发布,不代表OFweek维科号立场。如有侵权或其他问题,请及时联系我们举报。
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